#Reflow oven profiling free#
So a common practice is to use a peak temperature of around 230C with about 45 to 60 seconds time above liquidus or TAL of 217C to allow necessary reflow and desired microstructure of lead free BGAs without damaging all the tin-lead components on the same board. And on top of that these tin-lead components may not withstand higher peak temperatures. Such a solder paste may not withstand higher peak temperatures and may cause dewetted and open solder joints if high peak temperatures are used.
Also keep in mind that in backward compatibility you are using tin-lead solder paste since most of the components on the board are tin-lead. If the tin-lead profile with maximum peak temperature of 220C is used, the BGA balls will not reflow at all or will partially reflow, creating a serious solder joint reliability. The real problem arises when using lead free BGAs on a primarily tin-lead board. In a backward compatibility scenario, it is not a serious issue when using leaded components such as SOIC, PLCC or fine pitch with lead free surface finishes on a primarily tin-lead board. In such as case the profile must accommodate both tin-lead and lead free package requirements. The problem can be further compounded by backward compatibility issues where some lead free components have to be used on a primarily tin-lead board. Even when the failures are found, they will keep on building boards using the same profiles and blame the failures on their suppliers or the designers instead. Such a guess work would not be so bad if they went back and checked the profiles using some failed boards because there are plenty of failed boards in such companies. They tend to guess the thermal mass of the board and use guess the oven settings that may work. For example, many companies do not even bother with using loaded board attached with thermocouples. However, this easy task is rarely performed by many companies.
#Reflow oven profiling software#
In case of BGAs, thermocouples need to be attached to the inner and outer rows of the balls as well.Ĭommercial hardware and software packages, such as MOLE, data pack and many others are available to make thermal profile development an easy task. With this tighter process window the importance of using product specific profile is becomes even more critical.įor developing the profile, you need the loaded board with six to eight thermocouples soldered to solder joints of large and small components across the board.
This reflow process window narrows to 15C since the soldering needs to be done between 230C to 245C. With tin lead eutectic composition one could easily get away by maintaining peak temperature between 190C to 225C, a variation of almost 35C and still achieve good reflow soldering results.
0 kommentar(er)
